The basic concepts of the Tape Automated 62List of abbreviationsCCL : Copper Clad LaminateCOF : Chip on FilmHDD : Hard Disk DriveLCD : Liquid Crystal DisplayPI : PolyimideTAB : Tape Automated BondingBonding (TAB) technology were designed by General Electric Company (the USA). Yet, its appli-cation is realized by a string of collaborative projects between “Shindo Denshi Kogyo Co., Ltd.” (the pio-neering flexible circuit manufacturer currently known as FLEXCEED Co., Ltd.) and Sharp Corporation (pre-viously a leading electronics manufacturer in Japan). As “Upilex S”, a polyimide (PI) film with excellent di-mensional stability newly created by Ube Industries, Ltd., was selected as the base material, it remained the only and exclusive option in the base material market for TAB circuits for quite a while. The coef-ficient of thermal expansion of Upilex S at the time About the AuthorFounder and Managing Director of DKN Research LLC, based in Massachusetts, USA. Engages in engineering, technology development, and product design of various electronic packaging technolo-gies. Has more than 30 years of experience in fields related to electronic packaging and is the industry’s foremost expert on flexible circuit board. Leads the industry with the technology of super high-density flexible composite circuit boards. Has published more than 100 papers related to technology and business and has also written books and lectured on several related fields.was less than 10 ppm/℃, which was more than 10 points higher than other general PI films. The gap was just phenomenal, which shaped Upilex S as the only choice for the new TAB circuit manufacturer to achieve the circuit density in driver modules for liquid crystal display (LCD) panels. Nonetheless, the Du Pont Group and Kaneka Corporation were by no means willing to give up creating high-dimensional and stable PI films for high-density circuits. The cor-porates were keenly eyeing an opportunity to de-velop grades with dimensional stability and develop their new market. Following the TAB technologies in our previous article, we are going to look into the market and technology changes for high dimensional stability PI film this time, which includes infesting topics about the trends in Chip on Film (COF) circuits previously captioned. DKN Research LLCDominique K. Numakuradnumakura@dknresearch.comThe Summary of the Previous Articlestale 13Tonic Information Part II Creative Applications Realized by High-Dimensional Stability grades
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