アーカイブ情報

2014/5/20

Convertech & e-Print May/Jun. 2014

Spe­cial Attention
neo func­tional mate­r­ial, Print­able Elec­tron­ics, nano tech 2014 Trade Show Report
Cutting-​edge Con­vert­ing Tech­nolo­gies Under One Roof
Asia’s Largest Pack­ag­ing Tech­nol­ogy Exhibition
Bangkok Hosts the Lat­est in Pack­ag­ing and Prod­uct Technology
PROPAK ASIA 2014

Fea­tures
Devel­op­ment of VOC Gas Sen­sor using Quartz Crys­tal Microbal­ance Coated with Plasma Poly­mer­ized Film
Hide­nobu Aizawa, Ryuichi Naganawa, Kazu­toshi Noda, National Insti­tute of Advanced Indus­trial Sci­ence and Tech­nol­ogy (AIST)
Devel­op­ing Lumi­nous Sil­i­con Nanopar­ti­cles Pro­duced in Sim­ple Devices
Keisuke Sato, Shun Kitazawa, Kenji Hirakuri, Tokyo Denki University

Series
Basics of Roll Coat­ing From the Plant Floor, Ses­sion 5
Coat­ing Overview (1)
Osamu Kuriyama

Pack­ag­ing Film Pro­duc­tion and Func­tion­al­iz­ing Technology
Part 5: Processed Prod­ucts (3)
Akira Hayashi

Fun­da­men­tals of Ten­sion Con­trol in Web Han­dling, Ses­sion 2
Types of Ten­sion (Torque) Con­trol and Speed Control
Kenji Arashiba, Mit­subishi Elec­tric Engi­neer­ing Com­pany Limited
Kaname Ter­ada, Mit­subishi Elec­tric Corporation

Basic Course on Instru­men­ta­tion and
Con­trol in the Con­vert­ing Process, Ses­sion 19
Yoshi­hiko Ohta, NIRECO CORPORATION

Screen Print­ing & Printed Elec­tron­ics, Clos­ing Session
Towards Com­mer­cial­iz­ing Printed Electronics
Yasushi Sano, SP-​Solutions Co., Ltd.

Intro­duc­tion to Flex­i­ble & Print­able Elec­tron­ics, Ses­sion 17
The State and Future of Flex­i­ble Sub­strates (1)
Dominique K. Numakura, DKN Research LLC

The A, B, Cs of Gravure Print­ing Machines, Ses­sion 3
Basic Spec­i­fi­ca­tions and Unit Struc­ture (3)
Takashi Mori­naga

Slit­ting Tech­nol­ogy, Ses­sion 2
Hideaki Taka­hashi, NISHIMURA MFG. CO., LTD.

Solv­ing Adhe­sion Prob­lems Dur­ing Film Pro­cess­ing, Ses­sion 1
Print­ing and Coat­ing Adhe­sion Problems
Tsu­tomu Isaka, Techno World

Extru­sion Coating/​Lamination Equipment/​Technologies and Man­u­fac­tur­ing (1)
Koichi Mat­sumoto, Pro­fes­sional Engi­neer (Indus­trial Management)
Focus On…
Strength­en­ing Group Coop­er­a­tion for a Syn­er­gis­tic Effect
Lead­ing the World in Wet and Dry Coating
HIRANO TEC­SEED Co., Ltd.

The World’s First Auto­mated Next-​generation GF2 OCA Laminator
Only 6 Months From Devel­op­ment to Deliv­ery to Taiwan
FUK Co., Ltd.

JF Tack­lite Stick Spe­cial Adhe­sive EVA Coating
Real­iz­ing a Wide Adhe­sion Range From –30°C to 170°C
NOPAR Inter­na­tional Asia

A Slid­ing Thin Film Ad Media Draws the Eye
Real­iz­ing Smooth Move­ment With Coat­ing Technology
Dai Nip­pon Print­ing Co., Ltd.

Cre­at­ing an Inter­na­tional Stan­dard for Printed Electronics
How Should Japan be Involved in Rule Making?

nano tech 2014/​Next-​generation Printed Elec­tron­ics Seminar
Printed Tem­per­a­ture His­tory Sen­sors for Indi­vid­ual Items
100 Mil­lion Square Meters Per Year of Sil­ver Nano Wire Film
OE-​A Open Sem­i­nar, Print­able Elec­tron­ics 2014

“FFGS WING CITY ashigara” Shows Off Water-​based Flexo’s Potential
Strength­en­ing Pack­ag­ing Busi­ness for 300 Bil­lion in Annual Sales
FUJI­FILM Global Graphic Sys­tems Co., Ltd.

Enter­ing the Grow­ing Indone­sian Print­ing Machine Market
Pro­mot­ing Gravure Print­ing Machines to Local Converters
Union­tech Co., Ltd.

Aug­mented Real­ity Appli­ca­tions Down­loaded in the Millions
Poten­tial Ranges From Edu­ca­tion to Mar­ket­ing Campaigns
Hei­del­berg Japan KK, Knowl­edge Works Inc.

Spe­cial­ized Gravure Cylin­ders Go Beyond Packaging
Wrin­kle Removal, Coat­ing, and Elec­tron­ics Cylinders
THINK LAB­O­RA­TORY CO., LTD.
 

カテゴリー

英字誌バックナンバー