アーカイブ情報

2014/11/20

Convertech & e-Print Nov./Dec. 2014

Special Attention
Converting Show 2015 Preview
Convertech JAPAN 2015, neo functional material, Printable Electronics, 3Decotech Expo,
Prototype and Contracted Manufacturing Exhibition, and Advanced Film Industry Expo
Full Content Listing for 2014
January/February to November/December 2014

Features
Latest Trends in Japanese Dry Laminators
Masamori Hirata, FUJIKIKAI KOGYO CO., LTD.

Developing Room to Low Temperature Sinterable Silver Nanoparticle Inks and Pastes
Masafumi Takesue, Bando Chemical Industries, Ltd., R&D Center

Organic Material Based, ITO-free Transparent Electrodes
Film Forming Via a Printing Process
Wataru Mizutani, Nanosystem Research Institute, National Institute of Advanced Industrial Science and Technology
Kazumi Aoba, Hideki Sakai, Takashi Ohmori, Hayato Hyakutake, Denshikako Co., Ltd.

Printed Stretchable Human Interface Using Cloth Substrates
Tomohiro Tokumaru, Bio Signal Co., Ltd.
Masahiro Inoue, Yasanori Tada, Yosuke Itabashi, Advanced Scientific Research Leaders Development Unit,
Gunma University

Flexible Electronics Oriented Electrical Contact Technology and Its Application
Ryosuke Mitsui, Product Development Center, Japan Aviation Electronics Industry, Limited

Series
Dry Lamination Equipment, Technology, and Manufacturing (1)
Koichi Matsumoto, Professional Engineer (Industrial Management)

Packaging Film Production and Functionalizing Technology
Part 8: Research and Development (2)
Akira Hayashi

Coating Theory and Phenomenon for the Plant, Chapter 1, Session 1
Coating Fundamentals: Wetting
Professor Akira Kawai, Nagaoka University of Technology

Solving Adhesion Problems During Film Processing, Closing Session
Adhesion Problems in Heat Seals
Tsutomu Isaka, Techno World

The Printed Electronics Market as Seen From Precision Slot Die Coating, Session 1
History and Current State of Slot Die Development
Naoki Rikita, MMC RYOTEC CORPORATION

Introduction to Flexible & Printable Electronics, Session 20
The State and Future of Flexible Substrates (4)
Dominique K. Numakura, DKN Research LLC

The A, B, Cs of Gravure Printing Machines, Session 6
Basic Specifications and Unit Structure (6)
Takashi Morinaga

Fundamentals of Tension Control in Web Handling, Closing Session
Inertia and Tension Control
Kaname Terada, Tsuguyasu Mizoue, Mitsubishi Electric Corporation

Basic Course on Instrumentation and
Control in the Converting Process, Session 22
Yoshihiko Ohta, NIRECO CORPORATION

Focus On...
Developing Nation Label Markets Ballooning
Transparent Labels and Security Labels From Japan
Label Forum Japan 2014

Silver Nanowire Ink for Touch Screen Transparent Conductive Patterning
Technological Reliability Is Key to Opening Printed Electronics Markets
SHOWA DENKO K.K.

Asia’s first APP Flexible Packaging Flexo Plate Making System
Full Automation From Washing to Storage
SEIKODO CO., LTD.

A Different Transparent Conductive Film Strategy Than FUJIFILM
Partnering with Kingsbury for Silver and UniPixel for Copper
Eastman Kodak Company

First Indigo 20000 in Asia Goes Into Operations at TSUKUBA 2025
Aiming for the Flexible Packaging and Label Printing Markets
SEIKOU CO., LTD.

HANDOO PACKAGE Ballard-on-Steel Surface Cylinders in Korea
Six New FX2 Lines Ordered From India
THINK LABORATORY CO., LTD.

Nano Abrasive Polishing Film
Removing Water Scale from Glass and Mirrors
Ricoh Industry Co., Ltd.

Increased TV Sizes Drive TFT-LCD Area Demand
Stable Growth Outlook for Automobile-use Monitors
NPD DisplaySearch

Ube Exsymo Aims Upisel-H Sales at Automotive Applications
Enabling Free design of LED for Automobile Headlights
Ube Exsymo Co., Ltd.
 

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